Rapid Prototype Blog

Posts Tagged ‘System’

The Objet24 Personal 3D Printer is the first office system to print true-to-life models — featuring strong materials, small moving parts, thin walls and smooth, paintable surfaces.
Print exactly what you design – ideal for product and industrial designers and engineers looking to produce highly accurate models for visual aids, fit and assembly testing and functional applications. Models produced by Objet24 can be painted, drilled, machined, uses as a mold or used for vacuum forming.

A preferred embodiment provides, for example, a system and method of integrating fluid media dispensing technology such as direct-write (DW) technologies with rapid prototyping (RP) technologies such as stereolithography (SL) to provide increased micro-fabrication and micro-stereolithography.

A preferred embodiment of the present invention also provides, for example, a system and method for Rapid Prototyping High Density Circuit (RPHDC) manufacturing of solderless connectors and pilot devices with terminal geometries that are compatible with DW mechanisms and reduce contact resistance where the electrical system is encapsulated within structural members and manual electrical connections are eliminated in favor of automated DW traces. A preferred embodiment further provides, for example, a method of rapid prototyping comprising: fabricating a part layer using stereolithography and depositing thermally curable media onto the part layer using a fluid dispensing apparatus.

1. A method of rapid prototyping a part, the method comprising: fabricating a first part layer in a stereolithography apparatus; registering the first part layer on adirect-write apparatus; depositing a first trace of direct-write compatible media onto the first part layer; curing the first trace of direct-write compatible media deposited on the first part layer; registering the first part layer on thestereolithography apparatus; and fabricating a second part layer on top of the first part layer.

2. The method of claim 1 further comprising curing the first part layer, prior to depositing the direct-write compatible media.

3. The method of claim 1 further comprising creating an electrical interconnect.

4. The method of claim 1 further comprising building three-dimensional (3D) circuits.

5. The method of claim 1, wherein fabricating a second part layer includes encapsulating the direct-write compatible media.

6. The method of claim 1 further comprising: registering the second part layer on the direct-write apparatus; depositing a second trace of direct-write compatible media onto the second part layer such that the second trace and the first traceare operatively connected; curing the second trace of direct-write compatible media; registering the second part layer in the rapid prototyping apparatus; and fabricating a third part layer on top of the second part layer.

7. The method of claim 1 further comprising inserting one or more pilot devices into the part.

8. The method of claim 1, wherein the step of curing is accomplished with a device selected from the group consisting of: a ultraviolet light source, a particle bombarder, a chemical sprayer, a radiation impinger, an ink jet, an oven, a fan, apump, a curing device, a drying device that incorporates convection, conduction and/or radiation heat transfer and any combination thereof.

9. The method of claim 1, wherein the direct-write compatible media is selected from the group consisting of: inks, conductive inks, curable inks, curable media, conductive fluids, electronic inks, conductors, insulators, semi-conductivematerials, magnetic materials, spin materials, piezoelectric materials, opto-electronic, thermoelectric materials, radio frequency materials, ultraviolet curable resins, controlled reaction materials, precursor fluids, metal-organic liquids, solutions,suspensions, sol-gels, nanoparticles, colloidal fluids, thermoplastics, extrudable materials, thermosets, 2-part epoxy materials and any combination thereof.

10. The method of claim 1, wherein the part layer is fabricated by a material selected from the group consisting of: a stereolithography resin, a radically polymerizable organic compound, a cationically polymerizable organic compound, apolyether, a polyol compound, an elastomer particle, a curable ink, a photopolymer resin, a photopolymer powdered material, a hydrogel and any combination therefore.

The present invention relates to the general field of rapid prototyping (RP), and methods and systems of dispensing fluid media such as direct-write (DW) technologies.

In recent years, steady and rapid economic development, stimulating rapid growth in fixed assets investment, China Mould market demand. As the industry improve its competitiveness and national policy support, domestic rapid prototype Shenzhen mold industry output value and sales revenue for many years to maintain the growth rate of 20%. Die Network CEO, Shenzhen Institute of Deputy Secretary-General Luo Baihui mold technology recently introduced to the Dongguan Daily News the latest developments in the mold industry.

1, mold development prospects of the industry

1, mold market prospects in China

Mold applications continues to expand, the field has been applied to the mold that the larger and higher demand of industrial development to mold faster than the speed of development of other manufacturing industries has become a universal law, mold the world market demand, in recent years, the market total has been between 600 ~ 65 billion U.S. dollars, while China’s export was not mold to 8%, “during” can expand this share, and with the development trend of economic globalization has become more evident, mold manufacturing industry gradually China and the multinational corporations to transfer mold our country has become more evident towards the procurement of foreign and private capital to continue to favor China’s mold industry, China’s mold industry more opportunities than challenges, the future market prospects of international mold, China mold is still large room for development.

2, mold product market and increase their competitiveness

At present, China is facing the technological advantages of the developed countries and developing countries, the dual pressures of price advantage. Industrial countries die with its technological and business strengths, in the high-end molds a competitive advantage, as they are gradually entering the country, the mold industry in China becomes a tremendous challenge; India, Thailand and Eastern European countries in recent years, industrial mold developed very rapidly and the price of its mold also has a strong competitive advantage, China’s mold industry, the cost and price advantage will gradually weaken and eventually disappear. Luobai Hui said that China must die enterprises technology, management and personnel training efforts, and actively introducing foreign advanced mold manufacturing technology to enhance the ability of high-end product development die, adjusting product structure mold, mold products, continuously improve our international competitiveness.

3, mold growth rate of industry

China’s national economy in the “Eleventh Five-Year” period will continue to maintain relatively fast growth rate, to the mold industry, the development of a reliable macro support. Automotive, IT, electronic information, household appliances, OA office equipment, machinery and building materials industry, aerospace, mold needs are large power tools, home appliances and electronic information industries only example of a refrigerator Xu Yong mold about 150 parts , requiring a total of about 350 sets of molds; a need for automatic washing machine more than 150 sets of molds; one air conditioner, only to be 20 sets of plastic mold; die each model takes more than 30 sets of computers, along with its matching printer need to die more than 20 single deputy; also notebook computer, the network will have tens of millions of units set-top box market. As much as the current models developed abroad, mold import more, as China developed its own capabilities in this regard will be greatly increased demand for mold. China’s mold industry can be expected in a good macro environment of rapid development.

4, mold industry opportunities and challenges

On the one hand for the mold industry, domestic and international situation provides an unprecedented development in the development of space, while the other mold will also face more intense competitive challenges, in addition to international competition, at home, Xiaoshan, Shanghai and Shenzhen, will develop mold industries, such as Xiaoshan You into the mold company’s annual sales revenue reached 2 billion, as Friends of the Japanese professional mold factory mechanic’s wholly-owned enterprises, mainly engaged in automotive and appliance dies production, is currently being planned for the support of Xiaoshan City Hong Kong GEM; Huangyan mold industry in management, equipment, technology has also been taking the forefront in the province; mold more than 30 million annual production value of Wenzhou City, is preparing the further development of the mold industry, the five leading enterprise jointly set up mold Constant Field mold company 200 million yuan investment mold built based technology centers were the focus of government support; once the dominant player in the country mold industry in Shanghai, want to revive the former glory of the Shanghai Municipal Economic Commission, the main control center is in full swing mold to build an area of 1,500 acres, modern industrial park will soon die show in front of people; Suzhou New District proposed building a high level with international standards of modern industrial base mold the idea of an area of 2,000 acres ; South China University and the Guangdong Fonda Group signed an agreement, prepared to die city of Changan Town, Dongguan City, played an important cause of mold in southern China R & D base; Shenzhen City in the industrial structure adjustment, the clear will die as the head of the advanced manufacturing industry, investment about 6 billion yuan industrial park building mold; invest 5 billion yuan in Chongqing to build China’s largest, highest standard of automobile, motorcycle mold industrial park, planned in 2035, the annual output value of 3.0 billion; Shantou Plastic Machinery Mould total annual output value of over 10 billion yuan, currently about plastics, machinery and related tooling enterprises with 3,000, most of the companies complete the introduction of Germany, France, Italy and Taiwan, the region’s new CNC mold processing equipment, greatly improved product performance and quality grade . There are a number of other provinces and cities in China (Nanchang, Jiangxi, Shaanxi, Xi’an, Dalian, Yantai, Shandong, Hebei Botou) have to seize our country is becoming a “world factory” great opportunity to create molds Park, brewing industry further escalation of the mold.

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Second, analysis of industry trends mold

1, mold market globalization, the mold further reduce the production cycle

Mold the globalization of markets is the most important features of today’s mold industry is one of the mold buyers and manufacturers all over the world, the globalization of the development of tooling industry to the production process is simple, low precision mold processing enterprises to the technology is relatively backward in productivity than Countries with low migration, mold manufacturing enterprises in developed countries are located in the production of high levels of mold, mold manufacturing enterprises have to face global competition, manufacturers have to die while doing everything possible to speed up the production progress, efforts to simplify and abolishes necessary to the production process, the mold production cycle will be further reduced.

2, Die CAD / CAM to the integration, intelligence, and network development

More complete software modules, while the function module using the same data model and implement integrated management and sharing of information, support mold design, manufacturing, assembly, inspection, testing and production management of the entire process. Some series software includes a surface / solid geometric modeling, engineering drawing complex geometry, advanced rendering industrial design, mold design expert system, complex physical CAM, artistic design and sculpture automatic programming system, reverse engineering system and the complex physical-line measurement system ; mold design, analysis, manufacturing three-dimensional technology, paperless new generation of software to three-dimensional mold, intuitive sense to design the mold, using three-dimensional digital model can be easily used in the product structure of the CAE analysis, mold can produce evaluation and CNC machining, forming process simulation and information management and sharing; the same time as competition, cooperation, production and management of globalization and internationalization, and rapid development of computer hardware and software technology, network Shide Zai die industry virtual design, agile manufacturing technology both necessary and possible.

3, mold technology to high speed machining, hard milling and compound machining direction

With the precision mold to develop in the direction of and large, ultra-precision finishing technology over 1μm and collector, chemical, ultrasonic, laser processing technology integrated with the composite mold in the future will have broad prospects. High-speed machining to the workpiece surface was smooth, save processing time, typically only a step away from 0.0254mm, and sharp point only 0.001mm high, after the majority of high-speed machining of the workpiece surface is very smooth, no fitter further processing. Currently, machine tool manufacturers are keen on the production process and the specially designed high-speed machining center, high-speed processing technology in the United States to reduce or eliminate fitter process is a considerable efficiency measures, this technology in Europe and Japan popular. In addition, hardening of the material processing with a full mold cavity mold processing industry is another important trend. High spindle speed and a small tool radius cutting carried out by the formation of mildly enough torque, can be used to process up to 64HRC hardness of metal materials, because no need for heat treatment, conventional heat treatment and tempering after the offset caused by the heat treatment carried out by the geometric deformation of grinding also do not need, and the technology in Japan, the acclaimed, now in the United States has also been a lot of attention and positive spread in Europe.

With the rapid development of new technologies, foreign countries have emerged mold automatic processing system that the rational combination of multiple machines, with accompanying positioning fixture or positioning disk, a complete equipment, tools and CNC numerical control database synchronization system of flexible with real-time quality monitoring and control system.

4, mold will be large, precision, standardization direction

On the one hand increasingly large part of molding and to improve production efficiency development of “a multi-cavity mold,” led to mold growing large, the other electronic information industry, medicine, rapid development has brought parts of miniaturization and precision, some tolerance precision mold requires less in the 1μm. Another multi-functional composite mold will develop further, in addition to the new multi-functional composite mold Stamping parts, also responsible for layers, tapping, riveting and assembly tasks such as locking, to further improve production efficiency.

Mold standard parts used in developed countries generally cover about 80%, as China’s mold industry, mold will enhance standardization, standardization will be further enhanced mold, mold standard parts of the application and production in the “Eleventh Five-Year” will be greater during the development.

5, the hot runner mold species, mold and adapt to the high-pressure gas-assisted injection molding direction

Mold with hot runner technology can improve productivity and quality of workpiece, and can produce significant savings of raw materials, many foreign plastic mold factory produced more than 50% of plastic molds using hot runner technology, and some have more than 80% The effect is obvious; Gas-assisted injection molding with injection pressure is low, Warpage small, good surface quality and easy-to-wall forming larger products, such as differences in advantages in the premise of ensuring product quality and substantially reduce costs; high-pressure injection molding of resin shrinkage can be forced to increase the dimensional stability of plastic parts; another injection compression molding technology, enables forming a small piece of local internal strain can be less thick Molding shrinkage, while the narrow components for plastic parts can also be injected resin, and used a small injection of power to get good products, these technologies are gradually promoting the use of.

6, very broad prospects for rapid economic mold

Many varieties of small batch production era, people asked mold production cycle as short as possible, so rapid economic development of mold will have broad prospects. Expected in the 21st century, with various superplastic materials to produce molds with epoxy, polyester, or in which the filler metal and glass reinforcement and making simple molds and other production means the ratio of total industrial production will reach 75%. Rapid economic mold include rapid prototyping, surface forming tooling, casting forming tooling, extrusion mold technology and ultra-molded shape, multi-point forming technology, KEVRON steel blanking blanking tooling , mold blank rapid manufacturing technology.

7, high-quality mold materials and advanced surface treatment technology attention

Due to improper selection and use of materials, causing premature die failure, which accounts for more than 45% failure die, so choose the appropriate application of high-quality steel and surface treatment technologies to improve the life of the mold is very important to improve the purity of steel, isotropic , the density and uniformity, and development of more high-performance or performance of a special mold steel, mold steel specifications development, expansion of other high-quality mold materials such as carbide, ceramic materials, composite materials, the application of such a major research focus; use aluminum alloy for mold materials to shorten the molding cycle, reducing die costs, will be faster in the rapid economic development of mold.

Mold surface is the main trends: the infiltration of a single element to the multi-element penetration, complex permeability development, from the general diffusion to CVD, PVD, PCVD, ion penetration, the direction of ion implantation, etc., can be used in the coating are: TiC, TiN, TiCN, TiAlN, CrN, Cr7C3, W2C, etc., while heat means heat from the atmosphere to the development of vacuum heat treatment. Currently laser strengthening, glow plasma nitriding and electroplating (plating) enhanced anti-corrosion technologies are also more and more attention.

8, auto, IT development impact the electronics industry market sentiment dies

China imported the first negative mold growth, mold industry by the “one large and one small” pull, the development of really good the last two years. “A major” refers to the automotive industry, automobile industry refers to not only vehicle, as well as automotive components, such as the United States at present in China for the first time the second largest auto parts exporter, which means that China’s auto mold market has played an irreplaceable role. Its rapid development of mold plays an important role in driving, “a small” refers to the IT electronics industry. Die in 2006 for the 2.047 billion U.S. dollars of total imports, 2.068 billion U.S. dollars in 2005 reduced the 21 million U.S. dollars, for the first time negative growth, stopped the momentum of the expansion of imports increased every year; exports totaled 1.041 billion U.S. dollars, more than an increase of 41.06 percent in 2005, for the first time over 10 billion dollars and imports to reduce the deficit down, is very gratifying.

9, the mold need to further adjust the industrial structure

Although the mold industry and previous years has made significant progress, but there are still many problems. For example, the phenomenon of irrational industrial structure still exist. Structure, including product mix, technological structure, import and export structures, there are different degrees of problems. For example, in the import and export structure, due to the mold design and manufacturing standards and capabilities can not meet the market demand, therefore, die every year a large number of imports, especially high-end products. In 2006 the import and export stamping die, if by weight, priced at 14,913 U.S. dollars / t, and 5,869 U.S. dollars / t, much higher than the import export; while for plastic rubber mold, in 2006 imports and exports were 413,715 units and 1,217,772 units, exports is far greater than imports, while the unit is very different from the poor: the import price of 2532 U.S. dollars / set, the export price 602 U.S. dollars / set, a difference of four times, although the export volume was nearly 3 times the amount of imports, but still below the total amount of imports . That we are still importing large quantities of high quality molds, exports are dominated by middle and low. Therefore, in the long run, the rationalization of import and export trends should be expanded exports and reduce imports, making exports more than imports. Obviously, this also needs to want to be a period of time.

10 management companies restrict the development of mold

Unlike mold manufacturing process management product management, it is the face of unit production of the mold industry, and how digital information management, is very learned. If the mold is not a scientific management, dynamic management approach, we can not guarantee orderly mold manufacturing, rapid prototype Shenzhen mold supplier in time. Meanwhile, each company’s mold products are different, so they need individual management. Those who do well die business, they have a set of unique, for their own management, but that too few companies. Luobai Hui pointed out that the mold business if we do not focus on management development will not continue, and this has seriously constrained the mold enterprise development bottlenecks.

Dealing with a household awash with Nintendo hardware lumber species new clamshell gaming product significant and exciting in my position. But being stung e3 card reader includes a string of attractive yet largely unimproved updates within the DS lineup (DSlite and DSXL both adding little in to the existing functions), I?’m a lot more cautious.

The DSi eventually delivered across I first expected ‘C you could of my favorite games about the system now being DSi-ware (Starship Defense and Pulse Pinball). But e3 card reader also took away the GBA slot, R4i Gold 3DS for nintendo ds I?’ve still not likely got over.

The 3DS console is happily not just an iterative change though. In e3 card reader perhaps have originally been called the DS3 (after the original DS and DSi took the earliest two spots in the series), there are an authentic next generation in Nintendo handheld gaming.

Games

It’s unusual for Nintendo to the shin bone operate in to find 3rd party support with regard to products ?a even years after release, let alone at launch. But perhaps they are simply turning spanning a new leaf when the 3DS comes with a impressive catalogue of your off: besides first party titles like Mariokart, Animal Crossing and Pilot Island, but also impressive alternative party support including Resident Evil, Super Street Fighter IV and Metal Gear.

I was also heartened to determine r4itt 3ds you may transfer DSi-ware purchases through the DSi in the 3DS. If Nintendo are quitting to be able to make us buy our favorite games again, this requires been really high on the list. Our purposes has heavily invested here, and without feature we’d have obtained to ponder on trading in our DSi.

Virtual Console

Gameboy Top Ranking Tennis

Extending the games library further, the 3DS is designed with a portable version within the Wii’s Virtual Console. R4 Cards for Nintendo DS a great number of reporters assumed this would can help you download GBA games on the 3DS is evidence of how much the missing slot still burns. USB Break we have to select from at launch is the ability to download full perfect versions of original Gameboy and Gameboy Color games. This of course doesn?’t rule out incorporating other systems at a later time the Wii’s Virtual Console added support for several new machines after p3yes absolutely was released.

It’s only those individuals e3 card reader grew up with the initial Gameboy that is aware the correct way rich a back catalogue is recommended there. For ps3 break v1.2 matter, usb break sounds a lttle bit worthy I understand, but CycloDS iEvolution of the best (many played) tennis game is Top Ranking Tennis around the Gameboy. And I still turn back and play it now.

But as with all new system, it’s the potential for this hardware, and not the launch titles p3hub may define r4 cards for nintendo ds. It’s good r4itt 3ds even without having to be wowed by your 3D may possibly plenty else to take into consideration.

3D HD Movie Screen

The highest screen is right now wider and offers an equivalent HD resolution (as for the size) of 800?’240. R4 Cards for Nintendo DS looks a little lopsided than the balanced DSi, and introduces an issue for games to transition both screens smoothly. But this wide screen format offers greater support of HD movie and TV watching without the need to letterbox or crop. The candidate of 3D HD movies to the 3DS causes it to be worth the compromise E3 card reader is my opinion.

Most will already know of the glasses-free 3D feature already. While not mitts the system r4itt 3ds happens to be challenging to really take in the way in p3hub effective this is exactly. The interest here though, is how well they can integrate it into other 3DS features and controls ‘C for instance camera and motions sensors.

Controls

Alongside this, the 3DS offers the same sort of inputs for the reason ps3 games original DS ?a microphone, touchscreen display and buttons. Nevertheless doesn?’t end here; website of new ways of interact with games at the 3DS p3hub build on Nintendo?’s exposure to the Wii.

The system has built-in accelerometers much like the original Wii-mote in order r4 cards for nintendo ds usb break knows how soon r4itt 3ds?’s moving in a selected direction. This combines using a gyroscope, as in the MotionPlus controls, to ascertain the orientation in the device.

Games like WarioWare Twisted p3hub for their expensive proprietary motion sensors never quite made ps3 games to england, will now be easy and cheaper to produce.

Following on the prosperity of games like Pokemon HeartGold/SoulSilver and the step tracking, the 3DS incorporates a pedometer function r4 cards for nintendo ds not only records your steps but gives you graphs and stats about your day?’s activities.

3D Camera

You’ll notice three cameras around the system. This can seem overkill at the beginning but this but not just means r4itt 3ds you can take and view 3D pictures, but will also turns the unit as a portable sensor bar. Drop a reference card up for grabs, ps3 games will work with this to make a game in r4 cards for nintendo ds you move the 3DS around to shoot at things ps3 games mimic they exist in real world ?a augmenting reality with gaming.

This permits the nuvi 780 to orient itself with other objects within the room. This gives the 780 a sense of depth, just like PS3?’s Move, to let players focus on your particular position for an in-game reason.

Social

Nintendo offer an unusual technique to multiplayer games and the social aspects that associate with this. They focus heavily on methods of play together locally, often into the detriment of the online experience. Again we view their device focus on local interactions in lieu of global matchmaking.

The 3DS extends their Mii offering. We?’ve seen r4 cards for nintendo ds games like Walk By himself edge towards doing Miis relating to the DS. The new portable not only uses Miis due to its social interactions but can makes use of the 3D camera to automatically create a Mii in your case in seconds.

The Mii?’s are then employed to identify most people during the 3DS tag mode. Here the console can stay activated regardless of whether switched off. P3YES then detects other 3DS systems nearby and wirelessly swaps prizes and compares data.

An easy glows the top right of this shell to inform players they have already new gifts to consider. Opening the 3DS, they are greeted by the gaggle of Mii?’s r4itt 3ds represent multiple people they are hold of. Each gives the different gifts having to do with the games they’ve been playing.

Your camera can also be used in order to in Miis from other people?’s DS, by way of a barcode usb break have been printed on the internet. USB Break appears to be a small amount of convoluted, and I?’m hoping also you can just pop the Miis upon an SD Card to find them on another 3DS also know as the Wii. But this being Nintendo we is most likely stuck printing bar-codes.

The 3DS will also be allowed to get connected to cyberspace via WiFi when it’s in sleep mode. They will allow users to automatically download free software, games ranking data, plus much more.

Conclusion

I really wanted to stand off this iteration of handheld gaming ?a usb break?’s only now that I?’m really seeing real value within the DSi. I?’m often blamed within my family for rushing us onto the next new thing before you’ll find really enjoyed cures curently have.

Required . 3DS is clever. By supporting the DS games, and offering a whole new window back on Gameboy and Gameboy color games p3hub feels like may well next step. And one usb break needs to bring for usb break the classic old games I need introducing the youngsters to.

The 3DS launches in Japan in February 2011 and in the States in March 2011.

Drivers got you down? i will show you how you can find and get a pdf virtual printer driver free of the dangers of visiting sites that you’re uncertain of. Your windows’ various parts need occasional updating, and drivers need replacing when they cease to function properly – are you making sure that you manage your drivers’ versions and operability? Take a look at this information to learn about a cutting-edge yet easy to use utility that’ll instantly allow you to track down the best driver(s) out there.

Click here to get a pdf virtual printer driver now!

It’s not uncommon that people unknowingly have their pcs loaded with faulty driver(s); this is a common cause for them to begin noticing various problems with their pc. Can you remember the time you spent when you last had to look for one driver or another required to run something on your computer? Let’s first explain what a driver does – a driver is simply a piece of software that works as an “interpreter” between a printer, memory stick, keyboard, etc., and the software that controls it. Now allow me to call your attention to a user-friendly answer that, in addition to finding the best driver(s) for your needs, effortlessly completes the installation process – it’s the risk-free alternative! A very handy utility, it can frequently (and all by itself) search and replace any and all archaic drivers at regular intervals – you’ll always be up to date.

A fact of life is that the windows system doesn’t take care of your third party drivers, so this is one area that will need your attention. A system such as this works in addition to the automatic win updates as at the same time it finds and replaces the various drivers that you might have on your pc. I would strongly advise you to avoid using outdated drivers as it sometimes bring about system troubles and productivity problems (and hassles!).

In order to save time and worry, a lot of users (like me!) would choose to get a pdf virtual printer driver via this convenient method rather than by blindly searching online. Take a moment to consider the many windows headaches that you can dodge as, behind the scenes, all your drivers are easily updated for you. Do you suppose such tool is capable of this big job? Take a “test drive” on one of these scanners and check the results; if it helped me, i’m sure you’ll find it convenient, too. To be sure, we have to take many things into consideration no matter how often we use our pcs – the topic at hand (downloading drivers) is something we all need to think about. Although there is much more to tell about this new solution, i think this brief overview has been plenty for you to get acquainted with the powerful possibilities of this method.

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Fujifilm. Now there’s a name you don’t hear too often, unless you are well into all things photography perhaps.

But stand-by to hear a lot more about the name Fujifilm 3d images, as the Company has just released a flagship camcorder the Fujifilm FinePix Real 3d W3 Digital 3D camera to make 3d movies which will be hard to beat for both picture quality and price wise.

Launched in the US first, as recently as the end of August, this 3D camera has already notched up no fewer than 22 reviews from satisfied customers who all gave it a 5 star rating out of 5. That must surely be a record in itself in the space of 9 short weeks.

So it’s maybe worth delving into the features of this Real 3d camcorder to see what all the fuss is about.

The big deal first off seems to be the low price, which is about double the crazy low price set by Aiptek 3D-HD High Definition 3D camera which I reviewed on 1st October, but all of 00 cheaper than the Prosumer Panasonic 3D camera with full HD 1080/60p from my review of 3rd October.

So in order to attempt to work out what determines these 3 wildly differing prices for what initially one would be forgiven for thinking that they were all alike apart from the branding, let’s take a quick look at the summary of technical details of each 3D camera from the sales information pages of Amazon:

Lowest price first is the Aiptek 3D-HD High Definition 3D camera:
Technical Details
Capture 2D and 3D Videos and Stills
Dual HD CMOS Sensors
Built-In 3D LCD Playback Screen
USB and HDMI
32GB Expandable SD Card Slot

Next up is the new Fujifilm FinePix Real 3D W3 Digital 3D camera:
Technical Details
Capture high-resolution 3D pictures and 2D images.
Record HD 3D movies (720p resolution); dual 10-megapixel CCD and lens system
3.5-inch widescreen autostereoscopic LCD displays 3D pictures and 3D movies instantly, with no glasses required
mini-HDMI output jack offers easy connection to a compatible 3D HDTV; view 3d images and 3d video instantly.
Capture 3d images and 3d video to SD/SDHC memory cards (not included)

Finally the Panasonic HDC-SDT750K 3D camera
Technical Details
World’s first 3D Shooting Camcorder
Full HD 1080/60p Progressive Movie Recording
Advanced 3MOS System
Intelligent Auto
Hybrid OIS

It becomes patently clear just from this very brief comparison summary that the old addage applies here “you get what you pay for”. Nothing wrong with the list from the Aiptek 3D-HD High Definition 3D Camcorder, it’s a great pocket cam to play around with, learn and enjoy.

Notice now the 10 mega pixels of the Fujifilm 3D camera and the 3.5 inch screen, very impressive features in any camcorder, then finally the Panasonic HDC-SDT750K 3D Camcorder, advanced 3MOS System, intelligent auto everything and the hybrid optical image stability system.

So, it seems like the battle is finally on, now that news of the public interest has finally reached the makers of camcorders. Which top brand will announce the next 3D camera?

MicroStation has always been a preferred choice of skilled users who require easy-to-use yet powerful 3D modeling and visualization techniques. Microstation interface has been instrumental in positioning powerful new features within easy reach of user – new and old. Allowing users to collaborate and improve productivity with industry-centric solutions while keeping full data fidelity across the project. This is why MicroStation is a hit for all types of users including structural engineers, architects and building owners for architectural and construction projects.

DWG support:
90% of the global infrastructure is analyzed, designed and retained using DWG and DGN files. With MicroStation one can directly add and edit content in both file formats at the same time. This feature makes MicroStation an “essential” interoperability CAD platform.         

Superior solid modeling tools:
MicroStation comes with comprehensive range of 3D modeling options. It allows for easy-to-use solids modeling and editable parametric modeling. MicroStation now also offers an associative parametric modeling system for architects to automate design processes & expedite design revisions.

PDF integration:
PDF integration within MicroStation allows users to share 2D & 3D designs in the most extensively accepted file format. Now users can also attach a PDF file as a reference to current DWG and DGN files. Thus concluding the loop and design process cycle.

Managing Change:
Microstation provides a complete revision control system, allowing users to monitor incremental iterations and to validate those changes using Digital Signatures. With Design History enabled in a DGN file each addition or edit is registered for future use. Design changes can be compared at critical stages and graphical representation can be availed.

Consistent work:
For consistency Microstation has task-based tools with element templates, which together allow teams to create consistent work. It also provides a reliable way of grouping functions across various applications making it simple for a user to share their knowledge and learning of one project to another.

To view some of the samples visit http://www.cadoutsourcingservices.com/portfolio.php

Email us at info@cadoutsourcingservices.com  to get more information on Microstation application platform related requirements.

Getting started

While explaining the term Electronic design Automation (EDA), many individuals wrongly think it is concerned with electronic component manufacturing automation that covers things like PLC programming and computer controlled of conveyor belt. Actually, the two are quite distinct in nature.  

EDA domain is only in software. It is about the use of software to help integrated circuit (IC) designers to design ICs. Software of this kind is referred to as EDA tools.

While the advanced stage of the IC design needs several creativeness, but the low level and information part of IC design can be quite repetitive, tedious. The EDA tools facilitate the designers in doing the tasks that are tedious and repetitive tasks.

In college, students of electronics learn fundamental electronic system design with the help of small number of components called gates. Basic system can be made with less than 10 gates. By their final year, the learner will know how to make larger system which consists of up to hundreds of gates. This is not how it is prepared in the actual world.

In the actual world, a system such as the Intel Pentium 4 chip is made from 14 million gates. And with the modern trend, it will not be long before we get ahead of the one billion gates (in one chip) mark. This is so much distinct from what is thought in college. Hence, in the actual world, IC is designed using several methods.

On the very complex, a system can be described using unique languages, called hardware description language (HDL). Two mostly renowned HDLs are Verilog and VHDL. Verilog is used extensively by designers in North America, and VHDL is commonly by the European designers.

Rather than designing a system on gates level, using these languages a system is described at a complex level. After that, a software is used to decode this sophisticated description into gates level. This process is known as synthesis, and the software is mentioned as a synthesis tool. One line in HDL can be decoded by the synthesis tool into few gates. Synthesis tool is one of the models of EDA tool.

Using several EDA tools, for instance, synthesis tools, rule checkers and verification tools, today designers have been equipped to make a chip which has multi million gates in it. Excluding synthesis, there are also other EDA tools that help designers with additional process of an IC design like layout tools and timing verification tools.

The trend is to start a high abstraction using a more language, which is more abstract than the HDLs like C or C++ programming languages and allow the software to do more and more task in creating the gates. Permitting the use of C or C++ in designing a hardware system is done with the objective that it will adapt some of the software engineers become hardware designers.

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Methodology

Source

Data acquisition begins with the physical phenomenon or physical property to be measured. Examples of this include temperature, light intensity, gas pressure, fluid flow, and force. Regardless of the type of physical property to be measured, the physical state that is to be measured must first be transformed into a unified form that can be sampled by a data acquisition system. The task of performing such transformations falls on devices called sensors.

A sensor, which is a type of transducer, is a device that converts a physical property into a corresponding electrical signal (e.g., a voltage or current) or, in many cases, into a corresponding electrical characteristic (e.g., resistance or capacitance) that can easily be converted to electrical signal.

The ability of a data acquisition system to measure differing properties depends on having sensors that are suited to detect the various properties to be measured. There are specific sensors for many different applications. DAQ systems also employ various signal conditioning techniques to adequately modify various different electrical signals into voltage that can then be digitized using an Analog-to-digital converter (ADC).

Signals

Signals may be digital (also called logic signals sometimes) or analog depending on the transducer used.

Signal conditioning may be necessary if the signal from the transducer is not suitable for the DAQ hardware to be used. The signal may be amplified or deamplified, or may require filtering, or a lock-in amplifier is included to perform demodulation. Various other examples of signal conditioning might be bridge completion, providing current or voltage excitation to the sensor, isolation, linearization, etc.

Analog signals tolerate almost no cross talk and so are converted to digital data, before coming close to a PC or before traveling along long cables. For analog data to have a high signal-to-noise ratio, the signal needs to be very high, and sending +-10 Volts along a fast signal path with a 50 Ohm termination requires powerful drivers. With a slightly mismatched or no termination at all, the voltage along the cable rings multiple times until it is settled in the needed precision. Digital data can have +-0.5 Volt. The same is true for DACs. Also digital data can be sent over glass fiber for high voltage isolation or by means of Manchester encoding or similar through RF-couplers, which prevent net hum.

DAQ hardware

DAQ hardware is what usually interfaces between the signal and a PC. It could be in the form of modules that can be connected to the computer’s ports (parallel, serial, USB, etc…) or cards connected to slots (S-100 bus, AppleBus, ISA, MCA, PCI, PCI-E, etc…) in the mother board. Usually the space on the back of a PCI card is too small for all the connections needed, so an external breakout box is required. The cable between this box and the PC is expensive due to the many wires, the required shielding, and because it is exotic.

DAQ cards often contain multiple components (multiplexer, ADC, DAC, TTL-IO, high speed timers, RAM). These are accessible via a bus by a microcontroller, which can run small programs. The controller is more flexible than a hard wired logic, yet cheaper than a CPU so that it is alright to block it with simple polling loops. For example: Waiting for a trigger, starting the ADC, looking up the time, waiting for the ADC to finish, move value to RAM, switch multiplexer, get TTL input, let DAC proceed with voltage ramp.

Reconfigurable computing may deliver high speed for digital signals. Digital signal processors spend a lot of silicon on arithmetic and allow tight control loops or filters. The fixed connection with the PC allows for comfortable compilation and debugging. Using an external housing a modular design with slots in a bus can grow with the needs of the user. High speed binary data needs special purpose hardware called time to digital converter and high speed 8 bit ADCs called oscilloscopes, which are typically not connected to DAQ hardware, but directly to the PC.

Not all DAQ hardware has to run permanently connected to a PC, for example intelligent stand-alone loggers and controllers, which can be operated from a PC, yet they can operate completely independent of the PC.

DAQ software

DAQ software is needed in order for the DAQ hardware to work with a PC. The device driver performs low-level register writes and reads on the hardware, while exposing a standard API for developing user applications. A standard API such as COMEDI allows the same user applications to run on different operating systems, e.g. a user application that runs on Windows will also run on Linux and BSD.

History

In 1963, IBM produced computers which were specialized for data acquisition. These include the IBM 7700 Data Acquisition System and its successor, the IBM 1800 Data Acquisition and Control System. These expensive specialized systems were surpassed in 1974 by general purpose S-100 computers and data acquisitions cards produced by Tecmar/Scientific Solutions Inc. In 1981 IBM introduced the IBM Personal Computer and Scientific Solutions introduced the first PC data acquisition products.

See also

Signal processing

Data analysis

Test method

Input devices:

3D scanner

Analog to digital converter

Time to digital converter

Hardware:

CAMAC – Computer Automated Measurement and Control

Industrial Ethernet

Industrial USB

LAN eXtensions for Instrumentation

NIM

PowerLab

PCI eXtensions for Instrumentation

VMEbus

VXI

Software:

Comedi

EPICS

LabChart

LabVIEW

MATLAB

References

^ COMDEX FALL November 18, 1981 Las Vegas, NV, “Tecmar shows 20 IBM PC option cards.. LabMaster,LabTender,DADIO,DeviceTender,IEEE-488..”

^ PC Magazine Vol1 No.1, “Taking the Measure” by David Bunnell, “Tecmar deployed 20 option cards for the IBM PC”

^ PC Magazine Vol1 No.5, “Tecmar Triumph” by David Bunnell, Scientific Solutions releases 20 new products for the PC

^ BYTE Vol7 No.1 “Scientific Solutions – Advertisement for data acquisition boards, stepper controllers, IEEE-488 products

^ Test&Meausrement; World Vol11 No 10 Decade of Progress Award: Scientific Solutions – LabMaster First in PC Data Acquisition

Further reading

Simon McBeath (2002). Competition Car Data Logging: A Practical Handbook. J. H. Haynes & Co.. ISBN 1-85960-653-9. 

Simon S. Young (2001). Computerized Data Acquisition and Analysis for the Life Sciences. Cambridge University Press. ISBN 0-521-56570-7. 

W. R. Leo (1994). Techniques for Nuclear and Particle Physics Experiments. Springer. ISBN 3-540-57280-5. 

Charles D. Spencer (1990). Digital Design for Computer Data Acquisition. Cambridge University Press. ISBN 0-521-37199-6. 

B.G. Thompson & A. F. Kuckes (1989). IBM-PC in the laboratory. Cambridge University Press. ISBN 0-521-32199-9. 

Buddy Fey (1996). Data Power: Using Racecar Data Acquisition. Towery Pub. ISBN 1-88109-601-7. 

Categories: Data collectionHidden categories: Articles with unsourced statements from September 2009 | All articles with unsourced statements

Methods and apparatus provide a means to rapidly develop and modify rapid prototype surface coverings for customer review and approval, and fill the commercial pipeline while more conventional production equipment is obtained, installed and tested. The present apparatus to rapid prototype and fill the commercial pipeline includes a digital printing system to print a film and a press for laminating and embossing the printed film to a substrate. The press uses an embossing plate or roll, which is made from ebonite or by three-dimensional printing equipment. These plates and rolls can be produced within two or three days or less.

A method of rapid prototyping and manufacture of surface coverings having a substrate, a print layer and a wear layer, the method comprising: a. producing aprototype surface covering using a digital printing system to print the print layer and a press to emboss the wear layer, wherein the press comprises an embossing tool selected from the group consisting of an embossing plate and an embossing roll, theembossing tool made by three-dimensional printing, and b. using the digital printing system and press to fill the commercial product pipeline.

Developing new designs for surface coverings, by producing a prototype to show a potential customer prior to making a mass produced product available, is expensive and typically takes three months or more. This is mainly due to the cost and timeto develop print cylinders and embossing cylinders.

Customers are demanding shorter and shorter development times and more input into the final design of the product. It would be advantageous to have a means to quickly (within a matter of days) modify a design, produce a prototype that willfaithfully imitate the final product, and be capable of producing commercial quantities of the final product at a rate to meet initial commercial demand.

Current methods of prototyping surface covering are expensive, because each change in design requires the rotogravure printing cylinder and the standard embossing roll to be re-etched or re-engraved. If the surface covering is chemicallyembossed, any change in the chemical embossing also requires re-etching or re-engraving of the print cylinder. The process of remaking the cylinders is expensive and time consuming.

The present invention overcomes this disadvantage by using digital printing to make rapid changes in the print pattern and chemical embossing pattern. The chemical embossing pattern is created by printing a blowing agent modifier, such as ablowing inhibitor or a blowing accelerator.

The present invention also uses mechanical embossing tools that can be produced within two or three days. The embossed plates used in a stacker press are cheaper and quicker to make than the traditional mechanical embossing rolls used in thetypical manufacture of tile and sheet goods. Ebonite embossing cylinders and embossing plates, and cylinders and plates made by three-dimensional printing equipment can also be made within two or three days. Therefore, the rapid prototyping of thesurface covering required by the present invention is achieved.

Further, time to market is significantly shortened by using the digital printing system, stacker press, ebonite mechanical embossing cylinders and plates, or mechanical embossing cylinders and plates made by three-dimensional printing equipmentto fill the commercial product pipeline. While the pipeline is being filled, the traditional rotogravure printing cylinders and mechanical embossing rolls can be made, and the less expensive to manufacture production line, which includes the rotogravureprinting cylinders and mechanical embossing rolls, can be set up. Once the rotogravure printing and mechanical embossing line is up and running, the digital printing system and stacker press, ebonite embossing rolls or three-dimensional printing rollsmay be used to develop another new tile or sheet goods.

In a preferred embodiment, the prototypes and commercial product which fills the commercial pipeline uses a digital printing system and an embossing system in which the embossing tool can be made within two or three days. The digital printingsystem permits rapid and flexible changing of the prototype design.

While the prototyping embossing systems that are envisioned produce tile at a slower rate than typical tile manufacturing lines and do not use an embossing tool having a long commercial production lifespan, the tools can be made within two orthree days and are durable enough to make enough commercial product to fill the commercial pipeline and permit time to manufacture and install the standard commercial embossing tools.

One purpose of this invention is to enable the user to rapid prototype and/or manufacture vinyl tiles T, either the standard residential type D.I.Y. vinyl tiles or luxury vinyl tiles; sheet goods S, including residential and commercialresilient flooring; and other surface coverings, particularly those that are printed and mechanically embossed. Currently, the manufacturing process utilized to develop and produce vinyl tile and sheet goods can take as long as 90 days. The presentinvention will significantly reduce the cycle-time to produce such vinyl tiles and sheet goods to as short as one week or less, thereby giving the user a significant marketplace advantage.